3 edition of CRRES micro--electronics package data analysis found in the catalog.
CRRES micro--electronics package data analysis
E. G. Stassinopoulos
Published
1993
by National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, National Technical Information Service, distributor] in [Washington, DC], [Springfield, Va
.
Written in English
Edition Notes
Statement | E.G. Stassinopoulos, G.J. Brucker, C.A. Stauffer. |
Series | NASA technical paper -- 3423. |
Contributions | Brucker, G. J., Stauffer, C. A., United States. National Aeronautics and Space Administration. Scientific and Technical Information Program. |
The Physical Object | |
---|---|
Format | Microform |
Pagination | 1 v. |
ID Numbers | |
Open Library | OL18067584M |
The next IMAPS-UK Webinar is “Micro-Electronics Packaging for Harsh Environments” Monday 20th January @ This is a free to join event – Book your place here This is the fifth in a series . @article{osti_, title = {Test of SEU algorithms against preliminary CRRES satellite data}, author = {McNulty, P J and Beauvais, W J and Abdel-Kader, W G and El-Teleaty, S S and Mullen, E G and Ray, K P}, abstractNote = {The CRRES satellite's highly elliptical orbit exposes the SEU-sensitive devices within the Microelectronics Package .
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Consulted in this study, especially the "CRRES-MEP Flight Data Analysis User's Manual", Version 3, of 21 April (1).
In order to proceed with the analysis, several preparatory activities were necessary, as for example: (i) Specially designed software package was developed to analyze the device SEU data extracted from the CRRES Data. A detailed in-depth analysis was performed on the data from some of the CRRES MEP (Microelectronics Package) devices.
These space flight measurements covered a period of about fourteen months of. Get this from a library. CRRES micro--electronics package data analysis.
[E G Stassinopoulos; G J Brucker; C A Stauffer; United States. National Aeronautics and Space Administration. Scientific and. Microelectronics Failure Analysis Desk Reference, 5th Ed. [Electronic Device Failure Analysis Society, The Electronic Device Failure Analysis Society Desk Reference Committee] on *FREE* shipping on qualifying offers.
Microelectronics Failure Analysis. Stassinopoulos E. G., Brucker G. and Stauffer C. () CRRES micro-electronics package flight data analysis, NASA Technical Paper Stassinopoulos E. G., Brucker G. J., Stauffer C. and Cited by: 1. The Microelectronics Test Package on the CRRES board contained more than 60 device types (Mullen and Ray, ).
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A previous analysis (Petersen ) reported apparently better agreement between AP8MAX-based calculations and the observed CRRES/MEP SEU rates, with an average calculated-to-observed ratio of ~ However, it is now acknowledged that those calculations were misleading, in that they failed to take into account details of the CRRES.
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The Sector Shielding Analysis. event upsets registered by the Microelectronics Package Experiment on CRRES (see "CRRES Microelectronics Test Package1' by E. Mullen and K. Ray, IEEE Trans. Nuc. Science,) b) Cosmic Ray Model. (Papers 7, 8, 9). The data. CRRES (see Satellite data sources, Environment 96codes) CTS Communications Technology Satellite (), Damage threshold of integrated circuits, illustrative (E.8, Fig.
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